Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 9 - Jul 14
Promo Codes Available:
For Your Every Summer RSVP, with Code: SUMMER15
Description
JTX JP-1 Preheating Platform Phone CPU Layering Glue RemovalJTX JP 1 300W Universal Phone Motherboard Preheating Platform mobile phone iPhone CPU layering, lamination, reballing tinning, and glue removal repair. JTX JP 1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly. Features: 1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and
JTX JP-1 300W Universal Phone Motherboard Preheating Platform mobile phone/iPhone CPU layering, lamination, reballing tinning, and glue removal repair. JTX JP-1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly.
Features:
1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and glue removal repair.
2. Improve efficiency, precise heating, suitable for mobile phone motherboards of various sizes
3. Heating plate is made of aviation aluminum, which can conduct heat quickly and is durable, which helps the device to have uniform heat distribution and a longer service life.
4. LED digital display thermostat with precise temperature control, which can be easily operated by preset temperature.
5. Maximum power 300Wg, wide voltage frequency conversion adaptation, supporting both 110V and 220V, and faster heating.
6. Enhanced heating area: With the help of the extended heating panel, it supports more motherboard sizes.
Parameters:
Name: JTX JP-1 Preheater.
Heating power: 300W.
Gross weight: about 635g.
Heating table: 102.2*70.2mm.
Temperature control range: 30-265°C.
Usage temperature recommendations:
200-300°C: BGA ball planting.
200-250C: LED lamp bead welding, repair.
180-220C: Motherboard layering and bonding.
150-200°C: Electronic circuit board rework preheating.
80-150°C: Box outer packaging film sealing.
80-120°C: Melting glue, mobile phone screen removal, frame removal.
30-100°C: Heating of laboratory reagents
30°C: Medical tests, bacterial culture, liquid heating.
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy